nanochip fab solutions
Equipment & Materials Engineering
Benchmarking & Productivity
Advanced Process Control & Data Analytics
Energy & Fab Sustainability
Parts & Services
Marketing & Industry Trends
Applied Materials’ new Applied SmartFactory® Fault Detection solution offers an economic, easy-to-implement way to improve tool and process performance in the back end.
As technology evolves, so does the demand for more power. Wide bandgap (WBG) materials such as gallium nitride (GaN) are demonstrating their potential as the backbone of next-generation power semiconductors.
2020欧洲杯外围APPApplied Materials is developing a quality improvement strategy that combines quality data in a cohesive and automated manner and maps the results into a Failure Mode and Effects Analysis (FMEA) system that provides users with recommended actions.
Given the complexity of Applied Materials equipment and spare parts there are plenty of physical and environmental packaging challenges. To address these, Applied has expanded its staff of packaging engineers, set up a lab, and worked with suppliers around the globe to align its packaging specifications with customer needs.
Semiconductor manufacturing over the past few decades has moved through several levels of technology, with each transition leading to lower costs and higher fab productivity. Now the industry is entering yet another change cycle, driven by increasing semiconductor quality requirements to meet the demands of IoT applications.
As semiconductor manufacturing moves into a “cyber-physical” era of smart manufacturing, providing data security in shared data environments such as cloud-based computing is proving to be an ongoing challenge.
Developing security standards so that data analysis experts can work together to solve thorny process control challenges remains a top priority as semiconductor manufacturing moves to a smart manufacturing model.
Leading conference on process control solutions for semiconductor and related high precision industries slated for San Antonio, Texas on October 28-31, 2019.
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